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Epoxy Resin glue Potting Adhesive for electronic components
HY484 epoxy potting glue is a two-component, self-leveling, room temperature curing epoxy resin potting material. It has excellent aging resistance, moisture resistance, electrical insulation, high hardness and high breakdown voltage. It’s suitable for all kinds of casting bonding and sealing of electronic components.
09-02-2023
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